Optimization and Evaluation of Sputtering Barrier/Seed Layer in Through Silicon Via for 3-D Integration
Study of the step coverage and contact resistance by using two-step TiN barrier and evolve simulation
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Structural devices: 7.3.4 Physical vapour deposition (PVD), sputtering - OpenLearn - Open University
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Effect of Process Parameters on the Angular Distribution of Sputtered Cu Flux in Long-Throw Sputtering System
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Effects of deposition conditions on step-coverage quality in low-pressure chemical vapor deposition of HfO2 - ScienceDirect
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Cu seed step coverage evolution with target lifetime for long-throw self ionized physical vapor deposition chambers - ScienceDirect
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